Staff Process Engineer

A leading global semiconductor solution provider is excited to welcome a Staff Process Engineer to their vibrant Penang team!

This is your chance to immerse yourself in world-class technology that powers a safer, healthier, greener, and smarter future across Automotive, Industrial, Infrastructure, and IoT sectors. You’ll join a truly collaborative culture where transparency, agility, and innovation are celebrated every day. Your expertise will spark impactful improvements in IC package assembly and die processes, all while enjoying flexible working opportunities and generous training support. The organisation champions diversity and inclusion, offering a competitive benefits package and an environment where you can grow professionally, connect with passionate colleagues, and make a real difference.

• Join forces with a global network of over 21,000 engineers and problem solvers across more than 30 countries—contributing to industry-leading advancements in semiconductor technology that shape the world.
• Experience flexible working opportunities and generous training support within a culture that thrives on transparency, agility, and innovation—ensuring you feel valued and empowered every step of the way.
• Enjoy a competitive benefits package as part of an inclusive workplace dedicated to supporting diversity, professional growth, and communal collaboration for all employees.

What you'll do:

As a Staff Process Engineer in Penang, you’ll be at the heart of driving process improvements within IC package assembly operations. Every day brings new opportunities to ramp up manufacturing volumes through effective qualification of sources while ensuring sustained line performance. You’ll energise initiatives aimed at boosting assembly yield, capacity, quality, and cost efficiency—leveraging your technical expertise in partnership with cross-functional teams including Test Engineers, Product Engineers, Quality professionals, and Operations. Your role involves addressing customer feedback promptly and managing product lifecycle documentation with precision. Change-management with suppliers is integral as you strive to optimise capacity and cost. You’ll also partner with Quality & Reliability teams to uphold rigorous standards while serving as the primary engineering interface for NPI-to-production transfers. Managing OSAT relationships is essential for supporting production continuity. Success in this role means engaging proactively with process engineering challenges related to materials selection, design optimisation, ultra-thin wafer handling techniques, SPS solder attach processes, and thin die technologies—all while contributing enthusiastically to a supportive team environment.

• Ramp up manufacturing volume efficiently by qualifying sources for IC package assembly processes and ensuring seamless production flow.
• Take charge of line sustaining activities by monitoring performance metrics and implementing corrective actions to maintain consistent quality throughout production.
• Drive continuous improvement initiatives focused on boosting assembly yield, increasing capacity, elevating quality standards, and reducing costs across all relevant processes.
• Respond proactively to internal and external customer feedback or issues by collaborating closely with Test Engineers, Product Engineers, Quality teams, and Operations organisations.
• Manage Product Lifecycle Management documents meticulously to keep status updates current and ensure compliance with industry requirements at all times.
• Conduct change-management activities with suppliers to sustain or enhance manufacturing capacity and cost-effectiveness while maintaining exceptional standards.
• Partner with Quality and Reliability teams to meet internal benchmarks as well as industry-wide customer standards for product excellence.
• Serve as the key manufacturing engineering interface during New Product Introduction (NPI) transfers to production—ensuring smooth transitions from development phases.
• Oversee OSAT (Outsourced Semiconductor Assembly and Test) and contract manufacturing relationships to support ongoing production needs effectively.
• Support production by providing technical guidance on process engineering challenges related to material selection, design optimisation, ultra-thin wafer handling, SPS solder attach processes, and thin die technologies.

What you bring:

The ideal candidate for the Staff Process Engineer position brings proven experience in semiconductor manufacturing environments coupled with robust academic credentials in mechanical engineering or applied sciences. Your proficiency in statistical process control methodologies enables you to analyse production data effectively while identifying areas for improvement. Strong interpersonal skills facilitate collaboration across multidisciplinary teams—essential when addressing customer feedback or partnering with quality assurance professionals. Project management capabilities are critical as you oversee large-scale initiatives involving process optimisation or change-management activities. Advanced knowledge of Cu Clip technology, Thin Die applications, Power QFN package development, ultra-thin wafer handling techniques, SPS solder attach processes, and Taiko wafer processing positions you as a valuable contributor during NPI-to-production transfers. Your ability to communicate complex technical concepts clearly ensures alignment among stakeholders throughout the product lifecycle.

• Degree in Mechanical Engineering, Material Science, Physics, Chemistry or Applied Sciences is required for this position—your academic foundation will set you up for success.
• Proficiency in Statistical Process Control (SPC) methodologies along with experience using statistical analysis software such as JMP is essential for driving data-driven improvements.
• Excellent interpersonal skills combined with strong written communication abilities empower you to collaborate effectively across diverse teams within the organisation.
• Demonstrated analytical skills allow you to interpret complex data sets for process improvement initiatives within semiconductor manufacturing environments—making your insights invaluable.
• Ability to manage large projects efficiently ensures successful implementation of new processes or changes within production lines—your organisational skills shine here.
• Experience in Cu Clip technology or Thin Die applications is highly desirable for candidates seeking advanced roles in package development—adding depth to your expertise.
• Knowledge of Power QFN package development provides added value when transitioning products from Development to Production phases—your know-how will be appreciated.
• Previous involvement in supporting New Product Introduction (NPI) through Mass Production demonstrates your capability in managing product lifecycles—showcasing your adaptability.
• Hands-on experience in process engineering or package development related to material/process/design of ultra-thin wafer handling or SPS solder attach processes is advantageous—your practical skills will make an impact.
• Familiarity with Taiko wafer processing further enhances your suitability for this specialised engineering role—bringing extra versatility to the team.

What sets this company apart:

This organisation stands out as a global leader in embedded semiconductor solutions driven by its purpose: To Make Our Lives Easier. With a worldwide presence spanning more than 30 countries and a team exceeding 21,000 engineers and problem solvers, it offers unparalleled opportunities for professional growth within Automotive, Industrial, Infrastructure, and IoT sectors. The company’s culture—TAGIE—is rooted in transparency, agility, global perspective, innovation, and entrepreneurial spirit. Employees benefit from flexible working arrangements that promote work-life balance alongside generous training opportunities designed to foster continuous learning. Diversity is celebrated here; the workplace is inclusive and supportive of under-represented groups while offering equal opportunity regardless of sex, race, religion or other protected characteristics. Competitive benefits packages reward commitment while nurturing talent through communal collaboration—a testament to the organisation’s dedication towards shaping industries that impact millions of lives worldwide.

What's next:

If you’re ready to energise your career by making a meaningful impact on the future of semiconductor technology within an enthusiastic global team—this is your moment!

Apply today by clicking on the link provided or email me at TengHong.Khoo@robertwalters.com.my to discuss this new opportunity!

Do note that we will only be in touch if your application is shortlisted.

Agensi Pekerjaan Robert Walters Sdn Bhd
Business Registration Number : 729828-T
Licence Number : JTKSM 423C