Packaging Engineer

A leading global semiconductor design and manufacturing organisation is seeking a Packaging Engineer to join their highly respected team in Melaka.

This is an exceptional opportunity for you to contribute your expertise within a supportive, inclusive environment that values knowledge sharing, professional growth, and ethical business practices. You will be surrounded by some of the industry’s most knowledgeable minds, collaborating on projects that shape the future of technology and impact customers worldwide. The company is deeply committed to responsible manufacturing, employee wellbeing, and community engagement, ensuring you are part of a workplace where your contributions are valued and your career can flourish. If you are passionate about process development, eager to work with advanced technologies, and thrive in a communal setting where kindness and respect are at the core, this role offers the perfect platform for you to make a meaningful difference.

• Join a globally recognised leader in semiconductor innovation, offering flexible working opportunities and ongoing training to support your professional development.
• Work alongside a diverse network of talented engineers in an environment that prioritises collaboration, inclusivity, and mutual respect.
• Be empowered to drive impactful projects from concept through to production release while benefiting from supportive leadership and generous opportunities for career advancement.

What you'll do:

As a Packaging Engineer based in Melaka, you will play a pivotal role in shaping the next generation of semiconductor products by leveraging your deep technical expertise in process development and package design. Your day-to-day responsibilities will involve optimising advanced manufacturing processes for multi-chip modules and power stage packages while collaborating with multidisciplinary teams across the globe. You will manage end-to-end project lifecycles—from conceptualisation through prototyping to full-scale production—ensuring each phase meets rigorous quality benchmarks. By engaging with both internal teams and external partners, you will help drive technology roadmaps forward while supporting continuous improvement efforts that enhance product reliability and manufacturability. Your ability to foster strong relationships within a collaborative environment will be key to delivering successful outcomes that align with organisational goals.

• Optimise and establish robust high-speed process parameters for multi-chip attach processes, stack-up configurations, and wire bonding technology to ensure reliable package performance.
• Define simplified manufacturing process sequences for power stage packages that enhance efficiency and maintain quality standards throughout production.
• Manage multiple new product executions from initial kick-off through prototyping, characterisation, learning cycles, qualification phases, and final product release using engineering methodologies such as JMP analysis, FMEA, and control plans.
• Collaborate closely with factory operations teams to achieve manufacturing indices, uphold stringent quality standards, and meet cost entitlements while fostering a spirit of teamwork.
• Engage with global package platform teams and emerging technology groups to execute differentiated technology roadmaps that anticipate future needs and establish advanced process capabilities.
• Enable competitiveness in power module packaging by adopting the latest industry advancements and maximising design flexibility for seamless integration of new technologies.
• Work cross-functionally to facilitate stress modelling activities aimed at identifying potential design weaknesses in packages and developing contingency plans to address them effectively.
• Coordinate with stakeholders across global design, manufacturing teams, component suppliers, material vendors, and substrate partners to ensure timely execution of complex projects.
• Drive continuous improvement initiatives focused on process optimisation, yield enhancement, defect reduction, and manufacturability constraints resolution.
• Support assembly operations by providing technical guidance on substrate design requirements and reliability considerations for power modules packaging.

What you bring:

To excel as a Packaging Engineer in this organisation, your background should reflect substantial hands-on experience within the semiconductor sector—particularly in areas such as process development for power stage modules or multi-chip assemblies. Your academic foundation in mechanical engineering or related disciplines equips you with the analytical skills needed to tackle complex challenges. You bring proven expertise in package layer design methodologies as well as practical know-how operating specialised equipment used throughout the manufacturing lifecycle. Your familiarity with advanced simulation tools like ANSYS/FEA enables you to conduct thorough stress analyses that inform robust design decisions. Beyond technical acumen, your interpersonal abilities allow you to build dependable relationships across multicultural teams—facilitating open communication channels that drive project success. Experience managing intricate projects involving SMT integration or SiP technologies further distinguishes your profile. Above all else, your commitment to nurturing collaborative partnerships ensures every initiative benefits from shared insights and collective problem-solving.

• Bachelor’s degree in Mechanical Engineering, Physics, Material Science or related field is required for this position.
• Minimum seven years’ experience within the semiconductor industry is essential for success in this role.
• Expert-level proficiency in process development for power stage modules and multi-chip module packaging is necessary.
• Demonstrated expertise in package layer design including structural configuration, material selection, and process flow optimisation is expected.
• Hands-on skills operating relevant machinery along with knowledge of material down-selection strategies for process optimisation and yield improvement are vital.
• Advanced experience using ANSYS or Finite Element Analysis (FEA) tools for stress modelling applications is required.
• Ability to collaborate effectively with geographically diverse teams while maintaining strategic vision over complex technology roadmaps is highly desirable.
• Practical experience with system-in-package (SiP), multi-chip packaging or package-on-package solutions would be advantageous.
• Familiarity with Design for Manufacturability (DFM) principles as well as defect criteria identification is beneficial.
• Experience coordinating multi-process integration between Surface Mount Technology (SMT) operations and back-end packaging processes adds value.

What sets this company apart:

This organisation stands out as a global force in semiconductor innovation—renowned not only for its technological achievements but also its unwavering dedication to ethical business practices and employee wellbeing. Here you will find an inclusive culture where every individual’s contribution is celebrated; respect, dignity, kindness, and courtesy form the foundation of daily interactions. The company invests heavily in training opportunities designed to expand your skillset while offering flexible working arrangements that accommodate personal commitments. Employees benefit from supportive leadership focused on growth leadership principles—empowering you to reach new heights professionally without sacrificing work-life balance. Community involvement is encouraged at every level; whether it’s through responsible manufacturing initiatives or local outreach programmes, you’ll have ample opportunity to give back alongside colleagues who share your values. Joining this team means becoming part of a network where knowledge sharing thrives—and where your passion for engineering can truly change lives around the world.

What's next:

If you are ready to take the next step in your career journey within an inclusive environment that values your expertise—this Packaging Engineer opportunity awaits your application!

Apply today by clicking on the link provided or email me at TengHong.Khoo@robertwalters.com.my to discuss this new opportunity!

Do note that we will only be in touch if your application is shortlisted.

Agensi Pekerjaan Robert Walters Sdn Bhd
Business Registration Number : 729828-T
Licence Number : JTKSM 423C