Our client is seeking a Senior Packaging Development Engineer to join their world-renowned team, to be based in Taiwan. This is an exhilarating opportunity to be part of an organisation that is revolutionising the way we use information to enrich life. The successful candidate will join a team that motivates the world to learn, communicate, and progress at unprecedented speeds.
What you'll do:
As a Senior Packaging Development Engineer, you will play a crucial role in identifying, selecting, and evaluating new equipment and technology. You will be responsible for developing innovative solutions for new equipment capabilities and addressing future technology requirements. Your role will involve active participation in Package Development Engineering activities, creating decision matrices for equipment and material selection, planning and submitting capital requests for new equipment acquisition. You will also establish project handover requirements and procedures upon machine qualification.
- Identify, select, and evaluate new equipment/technology to support current and future requirements
- Develop innovative solutions for new equipment capabilities/solutions to identified constraints or future technology requirements
- Engage in active participation in Package Development Engineering activities
- Create decision matrix for equipment and material selection
- Plan/submit capital request to acquire new Equipment
- Establish project handover requirements and procedures upon machine qualification
- Conduct data gathering for low volume production
- Maintain a matrix of key equipment platform capability and constraints
What you bring:
The ideal candidate for the Senior Packaging Development Engineer position should have basic knowledge in semiconductor manufacturing assembly, wafer bumping packaging technologies & advanced packaging techniques. A minimum of 3 years’ experience in the related semiconductor industry is required along with technical knowledge on assembly/wafer bumping/advanced packaging technology. You should be a fast learner, with initiative and independence, and have the ability to integrate and cooperate with cross function teams and external vendors.
- PhD/Masters/Bachelor’s Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience Required
- Basic knowledge in semiconductor manufacturing assembly, wafer bumping packaging technologies & advanced packaging techniques
- Minimum 3 years’ experience in related semiconductor industry
- Experience with technical knowledge on assembly and/or wafer bumping and/ or advanced packaging technology
- Understanding and/or experience in equipment automation solution e.g. GEM300, AMHS and IIOT solution for datamation such as APC, FDC, E3, PCS, SPC)
- Fast learner, with initiative and independence (min supervision)
- Good team player, ability to integrate and cooperate with cross function teams and external vendors
- Strong communication and presentation skills
What sets this company apart:
Our client is an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. Every day, the innovations that their people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data centre to the intelligent edge and across the client and mobile user experience.
What's next:
Ready to elevate your career? Apply now! Don't wait! Apply today by clicking on the link!
Do note that we will only be in touch if your application is shortlisted.
Agensi Pekerjaan Robert Walters Sdn Bhd
Business Registration Number : 729828-T
Licence Number : JTKSM 423C
