Our client is a global leader in memory and storage solutions, transforming how the world uses information to enrich life for all.
They are currently seeking an experienced Process Engineer with a focus on Wafer Bonding to work in Taiwan. This role offers the opportunity to contribute to the development of cutting-edge technology that powers advancements in artificial intelligence and 5G applications. The successful candidate will be part of a team that fuels the data economy, enabling breakthroughs from the data centre to the intelligent edge and across the client and mobile user experience.
- Opportunity to work with innovative memory and storage solutions
- Contribute to advancements in AI and 5G applications
- Be part of a team fuelling the data economy
What you'll do:
As a Wafer Bonding Process Engineer, your primary responsibility will be to drive improvements in wafer bonding processes. You will establish and enhance process conditions, upgrade process capabilities, and work towards reducing production costs. Your role will involve setting up process parameters for various semiconductor equipment, evaluating, promoting, and planning new equipment or materials. Additionally, you will be tasked with abnormal analysis and improvement. This role requires relocation to Taiwan.
- Establish and improve process condition and technology
- Upgrade process capability and reduce production cost
- Establish and modify process management projects
- Set up process parameters for a variety of semiconductor equipment
- Evaluation, promotion and planning of new equipment / materials
- Abnormal analysis and improvement
What you bring:
The ideal candidate for the Wafer Bonding Process Engineer role brings extensive experience in wafer bonding. You have demonstrated your ability to establish and improve process conditions and technology throughout your career. Your expertise includes upgrading process capabilities while reducing production costs. You have a proven track record in establishing and modifying process management projects. Your skill set includes setting up process parameters for various semiconductor equipment as well as evaluating, promoting, and planning new equipment or materials.
- Proven knowledge in Wafer Bonding with at least 5 years of experience
- Ability to establish and improve process condition and technology
- Experience in upgrading process capability and reducing production cost
- Proficiency in establishing and modifying process management projects
- Experience in setting up process parameters for a variety of semiconductor equipment
- Skill in evaluation, promotion and planning of new equipment / materials
What sets this company apart:
Our client is a manufacturing and production industry leader in innovative memory and storage solutions that transform how the world uses information to enrich life for all. With a relentless focus on their customers, technology leadership, manufacturing excellence, they deliver a rich portfolio of high-performance DRAM, NAND, NOR memory, and storage products through their renowned brands. Every day, the innovations created by their team fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities across various sectors. They are committed to providing equal employment opportunities without regard to race, colour, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
What's next:
Ready to be part of a team that's transforming how the world uses information? Apply now!
Apply today or email me at tenghong.khoo@robertwalters.com.my to discuss this new opportunity.
Please note that our client does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment.
Do note that we will only be in touch if your application is shortlisted.
Agensi Pekerjaan Robert Walters Sdn Bhd
Business Registration Number : 729828-T
Licence Number : JTKSM 423C
